TOP STORY... March 19, 2009  A panel of experts at the IMAPS Device Packaging Conference considered the challenges facing 3-D manufacturing, including the role of foundries, assembly and test vendors, EDA tool providers and equipment companies. IBM is planning to use 3-D IC technology in future products, with announcements expected soon, said IMAPS participant David Danovitch, a senior engineer at IBM's Bromont, Canada, facility.
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